Different scaling ratio in FEOL/ MOL/ BEOL

ABSTRACT

In some embodiments, the present disclosure relates to an integrated chip. The integrated chip has a plurality of gate structures arranged over a substrate. A plurality of first MOL (middle-of-line) structures are arranged at a first pitch over the substrate at locations interleaved between the plurality of gate structures. The plurality of first MOL structures connect active regions within the substrate to an overlying metal interconnect layer. A plurality of second MOL structures are arranged at a second pitch over the plurality of gate structures at locations interleaved between the plurality of first MOL structures. The plurality of second MOL structures connect the plurality of gate structures to the metal interconnect layer. The second pitch is different than the first pitch. The different pitches avoid misalignment errors between the plurality of gate structures and the metal interconnect layer.

REFERENCE TO RELATED APPLICATION

This Application is a continuation of U.S. application Ser. No.14/082,487 filed on Nov. 18, 2013, the contents of which areincorporated by reference in their entirety.

BACKGROUND

Over the last four decades, the density of integrated circuits (ICs) hasincreased according to a relation known as Moore's law. Moore's Lawstates that the number of transistors within an integrated circuit (IC)doubles from one technology node to another technology node (i.e., every18 months), and consequently the chip area used for a fixed number oftransistors is cut in half. The smaller sizes provide for silicon costsavings and increased IC performance (e.g., increased processing speed,memory capacity, etc.). In large part, this remarkable increase in theperformance of ICs has ushered in the dawn of today's information age.However, unlike laws of nature, which hold true regardless of mankind'sactivities, Moore's law only holds true so long as innovators overcomethe technological challenges associated with it.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a flow diagram of some embodiments of a method ofgenerating a scaled integrated chip design having different FEOL andBEOL scaling ratios.

FIGS. 2-4 illustrate some embodiments of cross-sectional views of anintegrated chip corresponding to a disclosed method of generating ascaled integrated chip design.

FIG. 5 illustrates a flow diagram of some alternative embodiments of amethod of generating a scaled integrated chip design.

FIGS. 6-7 illustrate some embodiments of cross-sectional views of anintegrated chip corresponding to a disclosed method of generating ascaled integrated chip design.

FIG. 8 illustrates a block diagram of some embodiments of an EDA(Electronic design automation) tool configured to execute the disclosedmethod of generating a scaled integrated chip design.

DETAILED DESCRIPTION

The description herein is made with reference to the drawings, whereinlike reference numerals are generally utilized to refer to like elementsthroughout, and wherein the various structures are not necessarily drawnto scale. In the following description, for purposes of explanation,numerous specific details are set forth in order to facilitateunderstanding. It may be evident, however, to one skilled in the art,that one or more aspects described herein may be practiced with a lesserdegree of these specific details. In other instances, known structuresand devices are shown in block diagram form to facilitate understanding.

In order to meet the demands of Moore's Law, the semiconductor industryhas consistently generated integrated chip (IC) designs for a newprocessing node by scaling entire IC designs from a previous processingnode by a scaling ratio of approximately 0.7. For example, a metal linehaving a width of 100 nm in an IC design for a 65 nm processing nodewould be scaled to have a width of 70 nm in an IC design for a 45 nmprocessing node.

As integrated chip minimum features sizes continue to decrease, it hasbeen appreciated that scaling entire IC designs by a constant scalingratio may be disadvantageous for a number of reasons. For example, foran integrated chip design having a lower back-end-of-the-line (BEOL)routing density and a higher front-end-of-the-line (FEOL) gate density,the BEOL pitch could be increased to improve RC performance of theintegrated chip without increasing overall chip area. Furthermore, thedifficulty in scaling FEOL and BEOL design layers are different, therebyresulting in increased processing difficulty to keep scaling factors thesame.

Accordingly, the present disclosure relates to a method of generating ascaled integrated chip (IC) design by scaling a FEOL and a BEOL of anoriginal IC design at different scaling ratios, and an associatedapparatus. In some embodiments, the method is performed by forming anoriginal integrated chip (IC) design that is a graphical representationof an integrated chip. The original IC design has afront-end-of-the-line (FEOL) section, a back-end-of-the-line (BEOL)section, and a middle-of-the-line (MOL) section that is disposed betweenthe FEOL and BEOL sections. A scaled integrated chip design is formed byscaling (i.e., shrinking) the FEOL section and the BEOL section of theoriginal integrated chip design at different scaling ratios, and byscaling different design layers within the MOL section at differentscaling ratios to avoid misalignment errors between the FEOL section andthe BEOL section.

FIG. 1 illustrates a flow diagram of some embodiments of a method 100 ofgenerating a scaled integrated chip design having different FEOL andBEOL scaling ratios.

At 102, an original integrated chip (IC) design comprising a graphicalrepresentation of an integrated chip is formed. The original IC designcomprises a front-end-of-the-line (FEOL) section comprising one or moresemiconductor devices, a back-end-of-the-line (BEOL) section comprisingmetal interconnect layers, and a middle-of-the-line (MOL) section. TheMOL section is disposed between the FEOL and BEOL sections and isconfigured to provide an electrical connection between the FEOL sectionand the BEOL section. The original IC design is associated with a firstprocessing node (e.g., a 32 nm processing node).

At 104, a scaled integrated chip (IC) design is formed by scaling theFEOL section and the BEOL section of the original integrated chip designat different scaling ratios. For example, in some embodiments, the FEOLsection may be scaled at a first scaling ratio (e.g., 0.7), while theBEOL section of the original integrated chip design may be scaled at asecond scaling ratio greater than the first scaling ratio (e.g., 0.6).The scaled IC design is associated with a second processing node (e.g.,a 22 nm processing node), which is smaller than the first processingnode.

In some embodiments, different design layers of the MOL section may bescaled at different scaling ratios to avoid misalignment errors betweenthe FEOL section and the BEOL section, at 106. For example, a firstdesign layer of the MOL section may be scaled at the first scalingratio, while a second design layer of the MOL section may be scaled atthe second scaling ratio.

At 108, an integrated chip may be generated on a semiconductor substratebased upon the scaled IC design.

FIGS. 2-4 illustrate some embodiments of a cross-sectional view of anintegrated chip corresponding to the disclosed method 100 of generatinga scaled integrated chip design. Although FIGS. 2-4 are described inrelation to method 100, it will be appreciated that the structuresdisclosed in FIGS. 2-4 are not limited to such a method, but instead maystand alone as an integrated chip.

FIG. 2 illustrates some embodiments of a cross-sectional view of anoriginal integrated chip (IC) 200 corresponding to an originalintegrated chip (IC) design, which shows the different design layers ofan original integrated chip.

The original IC 200 comprises a front-end-of-the-line (FEOL) section202, a middle-of-the-line (MOL) section 204, and a back-end-of-the-line(BEOL) section 206. The FEOL section 202 comprises an active regiondesign layer 209 and a gate design layer, such as a poly-silicon designlayer 210, which is disposed within a dielectric material 211 locatedover a semiconductor substrate 208. The BEOL section 206 comprises aplurality of metal via design layers 216, 220 and metal wire designlayers 218, 222 disposed within inter-level dielectric layers 215, 29.The MOL section 204 comprises a MD design layer 212 configured toconnect the active region design layer 209 within the semiconductorsubstrate 208 to the first metal via design layer 216 (i.e., an activeregion contact) and a MP design layer 214 configured to connect thepoly-silicon design layer 210 to the first metal via design layer 216(i.e., a poly-silicon contact).

The design layers of the FEOL section 202, the MOL section 204, and theBEOL section 206 are set up to have design shapes that may be spacedaccording to pitches. For example, in the FEOL section 202 thepoly-silicon design layer 210 comprises poly-silicon shapes that arespaced according to a poly-silicon pitch P_(PO) that is equal to adistance between a first edge of a first poly-silicon shape 210 a (e.g.,a first poly-silicon gate) and a first edge of an adjacent poly-siliconshape 210 b (e.g., a second poly-silicon gate). The MOL section 204comprises a MD pitch P_(MD) and a MP pitch P_(MP). The MD pitch P_(MD)is equal to a distance between a first edge of a first MD shape 212 aand a first edge of an adjacent MD shape 212 b. The MP pitch P_(MP) isequal to a distance between a first edge of a first MP shape 214 a and afirst edge of an adjacent MP shape 214 b. The BEOL section 206 comprisesa metal routing pitch P_(M). The metal routing pitch P_(M) is equal to adistance between a first edge of a first metal shape (e.g., metal viashape 216 a) and a first edge of an adjacent metal shape (e.g., metalvia shape 216 b). In some embodiments, the first metal via designsshapes connected to the MP design layer 214 are located on a differentmetal routing pitch than the first metal via design shapes connected tothe MD design layer 212.

FIG. 3 illustrates some embodiments of cross-sectional views 300, 302showing the scaling of a design layer of the original IC 200.

Cross-sectional view 300 illustrates metal shapes corresponding to anoriginal IC design, which are spaced according to a metal routing pitchP_(M) that is equal to a distance between a first edge of a first metalvia shape 216 a and a first edge of an adjacent metal via shape 216 b.Cross-sectional view 302 illustrates scaled metal shapes correspondingto a scaled IC design, which are separated by a scaled metal routingpitch P_(M)′. The scaled metal routing pitch P_(M)′ has been shrunk by ascaling ratio S, so that the scaled metal routing pitch P_(M)′ issmaller than the original metal routing pitch P_(M).

FIG. 4 illustrates some embodiments of a cross-sectional viewcorresponding to a scaled integrated chip (IC) 400 of a scaled ICdesign, which shows the different design layers of a scaled IC.

The scaled IC 400 comprises a FEOL section 202′ having a scaledpoly-silicon design layer 210′ that has been scaled by a FEOL scalingratio A with respect to the poly-silicon design layer 210 of theoriginal IC design 200. The FEOL scaling ratio A is equal to the scalingratio of the poly-silicon pitch between the original IC 200 and thescaled IC 400. In other words, FEOL scaling ratio A is equal to thescaled poly-silicon pitch P_(PO)′ divided by the original poly-siliconpitch P_(PO).

The scaled IC 400 further comprises a BEOL section 206′ having scaledmetal interconnect design layers 216′-222′ that have been scaled by aBEOL scaling ratio C with respect to the metal interconnect designlayers 216-222 of the original IC 200. The BEOL scaling ratio C is equalto the scaling ratio of the metal layer pitch between the original IC200 and the scaled IC 400. In other words, BEOL scaling ratio C is equalto the scaled metal layer pitch P_(M)′ divided by the original metallayer pitch P_(M).

The scaled IC 400 further comprises a MOL section 204′ having a scaledMD design layer 212′ that has been scaled by a MD scaling ratio B₁(i.e., a first MOL scaling ratio) with respect to the MD design layer212 of the original IC 200 and a scaled MP design layer 214′ that hasbeen scaled by a MP scaling ratio B₂ (i.e., a second MOL scaling ratio)with respect to the MP design layer 214 of the original IC 200. The MDscaling ratio B₁ is equal to the scaling ratio of the MD pitch betweenthe original IC 200 and the scaled IC 400 (i.e., the MD scaling ratio B₁is equal to the scaled MD pitch P_(MD)′ divided by the original MD pitchP_(MD)). The MP scaling ratio B₂ is equal to the scaling ratio of the MPpitch between the original IC 200 and the scaled IC 400 (i.e., the MPscaling ratio B₂ is equal to the scaled MP pitch P_(MP)′ divided by theoriginal MP pitch P_(MP)).

In some embodiments, the BEOL section 206′ is scaled at a BEOL scalingratio C that is greater than a FEOL scaling ratio A at which the FEOLsection 202′ is scaled. For example, in some embodiments, the FEOLscaling ratio A is in a range of between approximately 70% andapproximately 80%, while the BEOL scaling ratio C is less than 70%. Insome embodiments, the MD scaling ratio B₁ is equal to the FEOL scalingratio C. In some embodiments, the MP scaling ratio B₂ is greater thanthe FEOL scaling ratio C.

FIG. 5 illustrates a flow diagram of some alternative embodiments of amethod 500 of generating a scaled integrated chip design havingdifferent FEOL and BEOL scaling ratios.

While disclosed methods (e.g., methods 100 and 500) are illustrated anddescribed below as a series of acts or events, it will be appreciatedthat the illustrated ordering of such acts or events are not to beinterpreted in a limiting sense. For example, some acts may occur indifferent orders and/or concurrently with other acts or events apartfrom those illustrated and/or described herein. In addition, not allillustrated acts may be required to implement one or more aspects orembodiments of the description herein. Further, one or more of the actsdepicted herein may be carried out in one or more separate acts and/orphases.

At 502, an original integrated chip (IC) design comprising a graphicalrepresentation of an integrated chip is formed. The original IC designcomprises a front-end-of-the-line (FEOL) section, a middle-of-the-line(MOL) section, and a back-end-of-the-line (BEOL) section. The originalIC design is associated with a first processing node (e.g., a 32 nmprocessing node).

In some embodiments, the original IC design may be formed by a designerusing a design software program. In some embodiments, the BEOL sectionmay be formed by an automatic place and route tool configured toautomatically place the shapes within the original IC design. In someembodiments, the original IC design may comprise a Graphic DatabaseSystem (GDS) file, such as a GDS or GDSII file. In other embodiments,the original IC design may comprise a CIF file, an OASIS file, or someother similar file format, for example.

At 504, the FEOL section of the original integrated chip design isscaled according to a FEOL scaling ratio. In some embodiments, the FEOLsection comprises a FEOL design layer comprising a poly-silicon gatedesign layer disposed over a semiconductor substrate. In someembodiments, the FEOL scaling ratio is in a range of betweenapproximately 70% and approximately 80% of the original IC design.

At 506, a first design layer within the MOL section of the original ICdesign is scaled according to a first MOL scaling ratio. The first MOLscaling ratio achieves a scaled first design layer having a first pitchthat matches a pitch of a FEOL design layer. In some embodiments, thefirst design layer comprises a MD design layer configured to connect anactive region design layer (within a semiconductor substrate) to a firstmetal via design layer.

At 508, a second design layer within the MOL section of the original ICdesign is scaled according to a second MOL scaling ratio. The second MOLscaling ratio achieves a scaled second design layer having a secondpitch that does not match a pitch of a FEOL design layer. In someembodiments, the second design layer comprises a MP design layerconfigured to connect a poly-silicon gate design layer to the firstmetal via design layer.

At 510, the BEOL section of the original integrated chip design isscaled according a BEOL scaling ratio that is different than the FEOLscaling ratio. In some embodiments, the BEOL section comprises a firstmetal via design layer, and a first metal wire layer disposed above thefirst metal via design layer.

At 512, an integrated chip may be generated on a semiconductor substratebased upon a scaled IC design comprising the scaled FEOL, BEOL, and MOLsections.

FIGS. 6-7 illustrate some embodiments of a cross-sectional view of anintegrated chip showing a disclosed method of generating a scaledintegrated chip design. Although FIGS. 6-7 are described in relation tomethod 500, it will be appreciated that the structures disclosed inFIGS. 6-7 are not limited to such a method.

FIG. 6 illustrates some embodiments of a cross-sectional view 600 of ascaled integrated chip corresponding to a scaled integrated chip design,which shows scaling of a MD design layer.

As shown in cross-sectional view 600, a poly-silicon gate design layerof an original IC design is scaled at a FEOL scaling ratio A to achievea scaled poly-silicon gate design layer 210′ having a scaled pitchP_(PO)′. The MD design layer of an original IC design is scaled at a MDscaling ratio B₁ to achieve a scaled MD design layer 212′ having a pitchP_(MD)′ that matches the scaled pitch P_(PO)′ of the scaled poly-silicondesign layer 210′. By scaling the MD design layer at a MD scaling ratioB₁ that causes the scaled MD design layer 212′ to have pitch P_(MD)′that matches a pitch P_(PO)′ of the scaled poly-silicon design layer210′, misalignment problems between the scaled MD design layer 212′ andthe scaled poly-silicon design layer 210′are avoided.

FIG. 7 illustrates some embodiments of a cross-sectional view 700 of anintegrated chip corresponding to a scaled integrated chip design, whichshows scaling of a MP design layer.

As shown in cross-sectional view 700, the MP design layer of an originalIC design at a MP is scaled at a scaling ratio B₂ to achieve a scaled MPdesign layer 214′ having a pitch P_(MP)′ that matches a scaled firstmetal via design layer (not shown) and that is different than the scaledpitch P_(PO)′ of the scaled poly-silicon design layer 210′.

Using different scaling ratios, B₁ and B₂, to respectively scale the MPand MD design layers, as shown in cross-sectional views 600 and 700,prevents misalignment problems between FEOL and BEOL sections of anintegrated chip using different scaling ratio. This is because theP_(MP)′ pitch achieved by scaling the scaled MP design layer 214′ by ascaling ratio B₂ has a value that allows for the scaled MP design layer214′ to electrically connect to both the scaled poly-silicon designlayer 210′ (scaled by a scaling ratio B₁) and a scaled first metal viadesign layer (scaled by a scaling ratio C), thereby preventing opensfrom occurring between the FEOL and BEOL. For example, in someembodiments, the P_(MP)′ pitch of the scaled MP design layer 214′ may bea little bit larger than a pitch P_(PO)′ of the scaled poly-silicondesign layer 210′ and equal to a pitch of the scaled first metal viadesign layer, so that the scaled MP design layer 214′ contacts theunderlying scaled poly-silicon design layer 210′ at different positionswhile maintaining electrical contact with the overlying first metal viadesign layer.

FIG. 8 illustrates a block diagram of some embodiments of an EDA(Electronic design automation) tool 800 configured to execute thedisclosed method of generating a scaled integrated chip design.

The EDA tool 800 comprises a computation element 802 and a memoryelement 804. The computation element 802 comprises a scaling element806. The memory element 804 is configured to store an originalintegrated chip (IC) design 808 (e.g., a GDS or GDSII file, a CIF file,or an OASIS file), a scaled integrated chip design 810, and computerreadable instructions (CRI) 812 that may provide for a method ofoperating one or more components of the EDA tool according to adisclosed method (e.g., method 100 and/or 500). In various embodiments,the memory element 804 may comprise an internal memory or a computerreadable medium.

The original integrated chip design 808 comprises afront-end-of-the-line (FEOL) section, a middle-of-the-line (MOL)section, and a back-end-of-the-line (BEOL) section. The FEOL sectioncomprises a gate design layer, such as a poly-silicon design layer,which is disposed over a semiconductor substrate. The BEOL sectioncomprises a first metal via design layer, and a first metal wire designlayer disposed above the first metal via design layer. The MOL sectioncomprises a MD design layer configured to connect the poly-silicondesign layer to the first metal via design layer and a MP design layerconfigured to connect the semiconductor substrate to the first metal viadesign layer.

The scaling element 806 is configured to scale (i.e., shrink) the FEOLsection and the BEOL section of the original integrated chip design 808at different scaling ratios to form the scaled integrated chip design810. In some embodiments, the scaling element is configured to scale theMD design layer of the original IC design at a MD scaling ratio toachieve a scaled MD design layer having a first pitch that matches apitch of the poly-silicon design layer, and to scaling the MP designlayer of the original IC design at a MP scaling ratio to achieve ascaled MP design layer.

In some embodiments, the EDA tool 800 may further comprises a designtool 814 configured to generate the original IC design 808. In someembodiments, the design tool 814 may comprise an automatic place androute tool configured to selectively route shapes on a plurality ofdesign levels to generate the original IC design 808. In otherembodiments, the design tool 814 may comprise a user interactive designenvironment that allows for designers to generate the original IC design808. In such embodiments, the EDA tool 800 may comprise an input device816 and/or an output device 818. The input device 816 is configured toallow a user to interact with the original IC design 808 and in variousembodiments may comprise a keyboard, mouse, and/or any other inputdevice. The output device 818 is configured to provide a graphicalrepresentation of the original IC design 808 that can be viewed by auser. In various embodiments, the output device 818 may comprise amonitor, for example.

It will be appreciated that while reference is made throughout thisdocument to exemplary structures in discussing aspects of methodologiesdescribed herein, that those methodologies are not to be limited by thecorresponding structures presented. Rather, the methodologies (andstructures) are to be considered independent of one another and able tostand alone and be practiced without regard to any of the particularaspects depicted in the Figs. Additionally, layers described herein, canbe formed in any suitable manner, such as with spin on, sputtering,growth and/or deposition techniques, etc.

Also, equivalent alterations and/or modifications may occur to thoseskilled in the art based upon a reading and/or understanding of thespecification and annexed drawings. The disclosure herein includes allsuch modifications and alterations and is generally not intended to belimited thereby. For example, although the figures provided herein, areillustrated and described to have a particular doping type, it will beappreciated that alternative doping types may be utilized as will beappreciated by one of ordinary skill in the art.

In addition, while a particular feature or aspect may have beendisclosed with respect to only one of several implementations, suchfeature or aspect may be combined with one or more other features and/oraspects of other implementations as may be desired. Furthermore, to theextent that the terms “includes”, “having”, “has”, “with”, and/orvariants thereof are used herein, such terms are intended to beinclusive in meaning—like “comprising.” Also, “exemplary” is merelymeant to mean an example, rather than the best. It is also to beappreciated that features, layers and/or elements depicted herein areillustrated with particular dimensions and/or orientations relative toone another for purposes of simplicity and ease of understanding, andthat the actual dimensions and/or orientations may differ substantiallyfrom that illustrated herein.

The present disclosure relates to a method of generating a scaledintegrated chip (IC) design by scaling a FEOL and a BEOL of an originalIC design at different scaling ratios, and an associated apparatus.

In some embodiments, the present disclosure relates to an integratedchip. In some non-limiting embodiments illustrated in, for example, FIG.4, the integrated chip 400 comprises a plurality of gate structures 210′arranged over a substrate 208. A plurality of first MOL (middle-of-line)structures 212′ are arranged at a first pitch P_(MD)′ over the substrate208 at locations interleaved between the plurality of gate structures210′. The plurality of first MOL structures 212′ are configured toconnect active regions 209 within the substrate 208 to an overlyingmetal interconnect layer 216′. A plurality of second MOL structures 214′are arranged over the plurality of gate structures 210′ at locationsinterleaved between the plurality of first MOL structures 212′, and areconfigured to connect the plurality of gate structures 210′ to the metalinterconnect layer 216′. The plurality of second MOL structures 214′ arearranged at a second pitch P_(MP)′ that is different than the firstpitch P_(MD)′.

In other embodiments, the present disclosure relates to an integratedchip. In some non-limiting embodiments illustrated in, for example, FIG.4, the integrated chip 400 comprises a plurality of gate structures 210′arranged over a substrate 208. The integrated chip 400 further comprisesa plurality of first MOL (middle-of-line) structures 212′ verticallyextending from the substrate 208 to an overlying metal interconnectlayer 216′. The plurality of first MOL structures 212′ are arranged at afirst pitch P_(MD)′. The integrated chip 400 further comprises aplurality of second MOL structures 214′ laterally interleaved betweenthe plurality of first MOL structures 212′ and vertically extending fromthe plurality of gate structures 210′ to the metal interconnect layer216′. The plurality of second MOL structures 214′ are arranged at asecond pitch P_(MP)′ that is different than the first pitch P_(MD)′.

In yet other embodiments, the present disclosure relates to anintegrated chip. In some non-limiting embodiments illustrated in, forexample, FIG. 4, the integrated chip 400 comprises a plurality of gatestructures 210′ arranged over a substrate 208. The integrated chip 400further comprises a plurality of first MOL (middle-of-line) structures212′ arranged at a first pitch P_(MD)′ and vertically extending from thesubstrate 208 to an overlying metal interconnect layer 216′. Theintegrated chip 400 further comprises a plurality of second MOLstructures 214′ laterally interleaved between the plurality of first MOLstructures 212′ and vertically extending from the plurality of gatestructures 210′ to the metal interconnect layer 216′. The plurality ofsecond MOL structures 214′ are arranged at a second pitch P_(MP)′ thatis larger than a pitch P_(PO)′ of the plurality of gate structures 210′and equal to a pitch P_(M)′ of structures of the metal interconnectlayer 216′ over the plurality of second MOL structures 214′.

What is claimed is:
 1. An integrated chip, comprising: a plurality ofgate structures arranged over a substrate; a plurality of first MOL(middle-of-line) structures arranged at a first pitch over the substrateat locations interleaved between the plurality of gate structures,wherein the plurality of first MOL structures are configured to connectactive regions within the substrate to an overlying metal interconnectlayer; and a plurality of second MOL structures arranged over theplurality of gate structures at locations interleaved between theplurality of first MOL structures, and configured to connect theplurality of gate structures to the metal interconnect layer, whereinthe plurality of second MOL structures are arranged at a second pitchthat is different than the first pitch and wherein a horizontal planethat is parallel to an upper surface of the substrate extends throughsidewalls of both the plurality of first MOL structures and theplurality of second MOL structures.
 2. The integrated chip of claim 1,wherein the second pitch is larger than a pitch of the plurality of gatestructures and equal to a pitch of structures of the metal interconnectlayer over the plurality of second MOL structures.
 3. The integratedchip of claim 1, wherein the plurality of second MOL structuresphysically contact uppermost surfaces of respective ones of theplurality of gate structures at different positions relative to centersof the respective ones of the plurality of gate structures.
 4. Theintegrated chip of claim 1, wherein the metal interconnect layercomprises a metal via layer arranged between the plurality of first andsecond MOL structures and an overlying metal wire layer.
 5. Theintegrated chip of claim 4, wherein the metal via layer comprises afirst plurality of metal vias connected to the plurality of first MOLstructures and a second plurality of metal vias connected to theplurality of second MOL structures, wherein the first plurality of metalvias have a different pitch than the second plurality of metal vias. 6.The integrated chip of claim 1, wherein the plurality of gate structurescomprise polysilicon.
 7. The integrated chip of claim 1, wherein theplurality of first MOL structures and the plurality of second MOLstructures have upper surfaces that are substantially co-planar.
 8. Theintegrated chip of claim 1, wherein the plurality of second MOLstructures have a first MOL feature straddling a first sidewall of afirst one of the plurality of gate structures and a second MOL featurestraddling a second sidewall of a second one of the plurality of gatestructures; and wherein the first sidewall and the second sidewall faceopposite directions.
 9. The integrated chip of claim 1, wherein opposingsides of one of the plurality of first MOL structures are laterallyseparated from closest ones of the plurality of second MOL structures bydifferent distances measured along the horizontal plane.
 10. Theintegrated chip of claim 1, wherein the first pitch is smaller than thesecond pitch.
 11. An integrated chip, comprising: a plurality of gatestructures arranged over a substrate; a plurality of first MOL(middle-of-line) structures vertically extending from the substrate toan overlying conductive interconnect layer, wherein the plurality offirst MOL structures are arranged at a first pitch; and a plurality ofsecond MOL structures laterally interleaved between the plurality offirst MOL structures and physically contacting upper surfaces of theplurality of gate structures, wherein the plurality of second MOLstructures are arranged at a second pitch that is different than thefirst pitch.
 12. The integrated chip of claim 11, wherein the secondpitch is larger than a pitch of the plurality of gate structures andequal to a pitch of structures of the conductive interconnect layer overthe plurality of second MOL structures.
 13. The integrated chip of claim11, wherein the conductive interconnect layer comprises a conductive viahaving a bottom surface contacting one of the plurality of first MOLstructures and an upper surface contacting a conductive wire thatextends past an outermost sidewall of the conductive via.
 14. Theintegrated chip of claim 13, wherein the conductive interconnect layercomprises a first plurality of metal vias connected to the plurality offirst MOL structures and a second plurality of metal vias connected tothe plurality of second MOL structures, wherein the first plurality ofmetal vias have a different pitch than the second plurality of metalvias.
 15. The integrated chip of claim 11, wherein the plurality offirst MOL structures and the plurality of second MOL structures haveupper surfaces that are substantially co-planar.
 16. The integrated chipof claim 11, wherein the plurality of gate structures are arranged overthe substrate in parallel to one another.
 17. The integrated chip ofclaim 11, wherein the first pitch is smaller than the second pitch. 18.An integrated chip, comprising: a plurality of gate structures arrangedover a substrate; a plurality of first MOL (middle-of-line) structuresarranged at a first pitch and vertically extending from the substrate toan overlying metal interconnect layer; a plurality of second MOLstructures laterally interleaved between the plurality of first MOLstructures and vertically extending from the plurality of gatestructures to the metal interconnect layer, wherein the plurality ofsecond MOL structures are arranged at a second pitch that is larger thana pitch of the plurality of gate structures and equal to a pitch ofstructures of the metal interconnect layer over the plurality of secondMOL structures; and wherein the plurality of second MOL structures havebottommost surfaces that are below topmost surfaces of the plurality offirst MOL structures.
 19. The integrated chip of claim 18, wherein thefirst pitch is different than the second pitch.
 20. The integrated chipof claim 18, further comprising: a first inter-level dielectric (ILD)layer laterally extending along a horizontal line between the pluralityof first MOL structures and the plurality of second MOL structures,wherein the horizontal line is parallel to an upper surface of thesubstrate.